RECIPE 3D – RIE/ICP etch simulator

RECIPE, IntelliSense’s RIE/ICP etch simulator, now has the capability to simulate wet and dry etching in 3D in IntelliSuite v8.5. This tool can simulate RIE, DRIE, ICP (Inductively Coupled Plasma), and Bosch etching, as well as combinations of these processes. Combinations of anisotropic, isotropic, and directional processes can also be etched. RECIPE can help to predict etch lead and lag as shown in the picture below.

RECIPE can also be used to predict sidewall scalloping, footing, etch profiles, and sidewall angles. The Response Surface Methodology-based etch database and ability to account for machine and chamber variations ensure accurate results for any simulation.

IntelliSuite at Cambridge

Researchers at the University of Cambridge recently used IntelliSuite to assist with the design of a micromachined electrostatic charge sensor. The group used IntelliSuite to simulate various designs of the device and determine which design would give them the desired resonant frequency. An SEM of the variable capacitor used in the device is shown below.

SEM of variable capacitor

The paper, “A Resonant Micromachined Electrostatic Charge Sensor”, is part of the September 2008 edition of the IEEE Sensors Journal and can be downloaded here.

3D System Visualization in SYNPLE

SYNPLE, IntelliSense’s system-level simulator, includes some major upgrades in the latest version of IntelliSuite. The new bus-based auto-wiring feature makes it easy to wire up multiple elements and create schematics from the bottom, up. Users can also import finite element models to develop complex systems from the top, down.

SYNPLE now allows you to visualize your results in 3D, so that you can visualize the system response including the MEMS and  electronics in 3D. Shown below is an animation of a micromirror modeled in SYNPLE.

We’re proud of the fact that SYNPLE is the first schematic tool specifically designed for MEMS, and we’re currently working hard on more upgrades to be included in IntelliSuite v8.6. Watch out for more new features coming soon!

One-click meshing in IntelliSuite

Automeshed structure based on MUMPS template

One powerful new feature in IntelliSuite 8.5 is the automeshing engine that allows users to go from mask layout to meshed structure with one click.  Meshes can be automatically generated based on popular process templates (MUMPS, SUMMiT-V, SCREAM, etc), and users also have the ability to define their own templates.  The self-adapting mesh feature optimizes the mesh size for each part of the structure to ensure accurate simulations and reduce the compute time.

You can use the automeshing feature by selecting “Automesh from mask layout” in the Mesh toolbar in IntelliSuite’s 3DBuilder.

IntelliSuite Version 8.5

426 days in the making, 4 months of rigorous beta testing at select locations …. countless cans of soda, endless cups of coffee and green tea… our best version of IntelliSuite yet! Ladies and gentlemen, girls and boys, welcome to version 8.5 

Every corner of IntelliSuite has been updated, revamped or given a fresh new look. You will see performance, stability and interface improvements across the board. From a fresh pixel-perfect look to blinding speed improvements to brand new functionality, this is the best version of IntelliSuite, yet. There are upgrades round every corner. Here are some of our favorite:

• Robust, one click, all hex meshing. Instantly transform your masks into meshes (3DBuilder)
• Dynamic 3D cross-sectioning of MEMS virtual prototypes (IntelliFAB/FABViewer)
• Brand new interface for Multiphysics modules (TEM, EMag, Microfluidics)
• Atomistic level etch simulation (IntelliEtch)
• 3d RIE, ICP/Bosch etch simulation (RECIPE 3D)
• Advanced Fluid structure interaction capabilities (FSI)
• Multi-domain bus based wiring (SYNPLE)
• Schematic capture editor designed for MEMS (SYNPLE)
• Fast Impedance Extraction (EMag)
• Capability of multi-valent pH dependant reactions(Microfluidics)

This is the must have upgrade for MEMS designers everywhere.

IntelliSense Interview: Zooming in on MEMS design with EDA

Here is a recent interview that we did with Industrial and Embedded Systems. As the MEMS and Nano

Mirror Array

 industry matures, the number of components per chip is increasing. While we’ve seen the integration in terms of MEMS mirror arrays for display and telecom switching applications, the trend is spreading to RF-MEMS. There’s some interesting work being done by Clark Nguyen’s group at UC Berkeley. 

 

The design challenges for designing multiple components on a chip are going to be very different from those faced by designing a single component on a chip. The interaction between elements becomes increasingly important. Element cross talk becomes an important factor.. More about this later…

In the meantime here is the interview that we did with IES…  BTW, the image was generated using the latest version of IntelliFAB/FABViewer part of our Clean Room suite of process simulation and visualization tools.