Tag Archives: IntelliSuite

One major feature in IntelliSuite v8.5 is the capability to simulate advanced fluid-structure interaction. And unlike other tools that can only handle rigid body simulations, IntelliSuite fully supports interactions with deformable, non-rigid bodies. Full coupling with the PiezoMEMS module makes it easy to analyze devices such as a piezoelectrically-actuated micropump, shown below.

Piezoelectrically-actuated micropump in IntelliSuite

Piezoelectrically-actuated micropump in IntelliSuite

In this recent paper in IEEE Electron Device Letters, IntelliSuite is used in the development of a single-crystal-silicon micromechanical resonator.  This bulk-mode resonator was designed to have a Q factor of 1.16 million for high frequency stability at a resonant frequency of 2.18 MHz.   IntelliSuite was used to validate this behavior for the specific resonator design.  Shown below is a schematic of the resonator and a contour plot of the displacement taken from the simulation in IntelliSuite.

Schematic and displacement results for resonator

Schematic and displacement results for resonator

RECIPE, IntelliSense’s RIE/ICP etch simulator, now has the capability to simulate wet and dry etching in 3D in IntelliSuite v8.5. This tool can simulate RIE, DRIE, ICP (Inductively Coupled Plasma), and Bosch etching, as well as combinations of these processes. Combinations of anisotropic, isotropic, and directional processes can also be etched. RECIPE can help to predict etch lead and lag as shown in the picture below.

RECIPE can also be used to predict sidewall scalloping, footing, etch profiles, and sidewall angles. The Response Surface Methodology-based etch database and ability to account for machine and chamber variations ensure accurate results for any simulation.

Researchers at the University of Cambridge recently used IntelliSuite to assist with the design of a micromachined electrostatic charge sensor. The group used IntelliSuite to simulate various designs of the device and determine which design would give them the desired resonant frequency. An SEM of the variable capacitor used in the device is shown below.

SEM of variable capacitor

SEM of variable capacitor

The paper, “A Resonant Micromachined Electrostatic Charge Sensor”, is part of the September 2008 edition of the IEEE Sensors Journal and can be downloaded here.

In “A Novel Design Methodology for MEMS Device“, a paper submitted to the 2007 IEEE Conference on

Micropump modeled in IntelliSuite

Micropump modeled in IntelliFAB.

Nanotechnology, researchers from Nankai University discuss virtual modeling and simulation of MEMS devices. As part of the paper, the group uses the IntelliFab/FabViewer module of IntelliSense’s Clean Room package to simulate the fabrication process of a thermally-actuated micropump. The figure on the right shows the entire device including the bimetallic membrane and microvalves.

Shown below is the process flow used to construct the bimetallic membrane of the micropump. The bimetallic strip is electro-thermally actuated (passing a current heats up the bimetallic strip causing the membrane to deflect up and down). The group also plans to substitute the bimetallic actuator with a piezoelectric actuator.Process flow for bimetallic membrane

Process flow for bimetallic membrane, automatically generated in IntelliSense’s Clean Room process modeling tools.

SYNPLE, IntelliSense’s system-level simulator, includes some major upgrades in the latest version of IntelliSuite. The new bus-based auto-wiring feature makes it easy to wire up multiple elements and create schematics from the bottom, up. Users can also import finite element models to develop complex systems from the top, down.

SYNPLE now allows you to visualize your results in 3D, so that you can visualize the system response including the MEMS and  electronics in 3D. Shown below is an animation of a micromirror modeled in SYNPLE.

We’re proud of the fact that SYNPLE is the first schematic tool specifically designed for MEMS, and we’re currently working hard on more upgrades to be included in IntelliSuite v8.6. Watch out for more new features coming soon!

426 days in the making, 4 months of rigorous beta testing at select locations …. countless cans of soda, endless cups of coffee and green tea… our best version of IntelliSuite yet! Ladies and gentlemen, girls and boys, welcome to version 8.5 

Every corner of IntelliSuite has been updated, revamped or given a fresh new look. You will see performance, stability and interface improvements across the board. From a fresh pixel-perfect look to blinding speed improvements to brand new functionality, this is the best version of IntelliSuite, yet. There are upgrades round every corner. Here are some of our favorite:

  • Robust, one click, all hex meshing. Instantly transform your masks into meshes (3DBuilder)
  • Dynamic 3D cross-sectioning of MEMS virtual prototypes (IntelliFAB/FABViewer)
  • Brand new interface for Multiphysics modules (TEM, EMag, Microfluidics)
  • Atomistic level etch simulation (IntelliEtch)
  • 3d RIE, ICP/Bosch etch simulation (RECIPE 3D)
  • Advanced Fluid structure interaction capabilities (FSI)
  • Multi-domain bus based wiring (SYNPLE)
  • Schematic capture editor designed for MEMS (SYNPLE)
  • Fast Impedance Extraction (EMag)
  • Capability of multi-valent pH dependant reactions(Microfluidics)

This is the must have upgrade for MEMS designers everywhere.