FabViewer is a new module in IntelliSense’s Clean Room suite of process simulation and visualization tools. After building up a process flow in IntelliFab, users can visualize the process simulation and final MEMS device in FabViewer. High-resolution JPEGs and movie files are easy to export for use in technical papers and presenations. A dynamic cross-sectioning feature allows for easy process debugging or failure analyses. Shown below is a cross-section of a device constructed with FabViewer.
IntelliEtch is a brand-new atomistic etch simulator with several powerful capabilities. Users can take into account ab initio effects and predict evolving surface morphologies. Wet and dry etching can be performed on high order planes or non-flat substrates. An etched structure can also be exported as an FEA model for further analysis. The figure below shows the development of silicon microneedles in IntelliEtch compared with experimental SEMs. This model demonstrates several of IntelliEtch’s advanced capabilities, including multi-step mask transfers and wet/dry combination etching.
One major feature in IntelliSuite v8.5 is the capability to simulate advanced fluid-structure interaction. And unlike other tools that can only handle rigid body simulations, IntelliSuite fully supports interactions with deformable, non-rigid bodies. Full coupling with the PiezoMEMS module makes it easy to analyze devices such as a piezoelectrically-actuated micropump, shown below.
Piezoelectrically-actuated micropump in IntelliSuite
RECIPE, IntelliSense’s RIE/ICP etch simulator, now has the capability to simulate wet and dry etching in 3D in IntelliSuite v8.5. This tool can simulate RIE, DRIE, ICP (Inductively Coupled Plasma), and Bosch etching, as well as combinations of these processes. Combinations of anisotropic, isotropic, and directional processes can also be etched. RECIPE can help to predict etch lead and lag as shown in the picture below.
RECIPE can also be used to predict sidewall scalloping, footing, etch profiles, and sidewall angles. The Response Surface Methodology-based etch database and ability to account for machine and chamber variations ensure accurate results for any simulation.
Researchers at the University of Cambridge recently used IntelliSuite to assist with the design of a micromachined electrostatic charge sensor. The group used IntelliSuite to simulate various designs of the device and determine which design would give them the desired resonant frequency. An SEM of the variable capacitor used in the device is shown below.
SEM of variable capacitor
The paper, “A Resonant Micromachined Electrostatic Charge Sensor”, is part of the September 2008 edition of the IEEE Sensors Journal and can be downloaded here.
SYNPLE, IntelliSense’s system-level simulator, includes some major upgrades in the latest version of IntelliSuite. The new bus-based auto-wiring feature makes it easy to wire up multiple elements and create schematics from the bottom, up. Users can also import finite element models to develop complex systems from the top, down.
SYNPLE now allows you to visualize your results in 3D, so that you can visualize the system response including the MEMS and electronics in 3D. Shown below is an animation of a micromirror modeled in SYNPLE.
We’re proud of the fact that SYNPLE is the first schematic tool specifically designed for MEMS, and we’re currently working hard on more upgrades to be included in IntelliSuite v8.6. Watch out for more new features coming soon!
Automeshed structure based on MUMPS template
One powerful new feature in IntelliSuite 8.5 is the automeshing engine that allows users to go from mask layout to meshed structure with one click. Meshes can be automatically generated based on popular process templates (MUMPS, SUMMiT-V, SCREAM, etc), and users also have the ability to define their own templates. The self-adapting mesh feature optimizes the mesh size for each part of the structure to ensure accurate simulations and reduce the compute time.
You can use the automeshing feature by selecting “Automesh from mask layout” in the Mesh toolbar in IntelliSuite’s 3DBuilder.
426 days in the making, 4 months of rigorous beta testing at select locations …. countless cans of soda, endless cups of coffee and green tea… our best version of IntelliSuite yet! Ladies and gentlemen, girls and boys, welcome to version 8.5
Every corner of IntelliSuite has been updated, revamped or given a fresh new look. You will see performance, stability and interface improvements across the board. From a fresh pixel-perfect look to blinding speed improvements to brand new functionality, this is the best version of IntelliSuite, yet. There are upgrades round every corner. Here are some of our favorite:
This is the must have upgrade for MEMS designers everywhere.
Here is a recent interview that we did with Industrial and Embedded Systems. As the MEMS and Nano
Mirror Array
industry matures, the number of components per chip is increasing. While we’ve seen the integration in terms of MEMS mirror arrays for display and telecom switching applications, the trend is spreading to RF-MEMS. There’s some interesting work being done by Clark Nguyen’s group at UC Berkeley.
The design challenges for designing multiple components on a chip are going to be very different from those faced by designing a single component on a chip. The interaction between elements becomes increasingly important. Element cross talk becomes an important factor.. More about this later…
In the meantime here is the interview that we did with IES… BTW, the image was generated using the latest version of IntelliFAB/FABViewer part of our Clean Room suite of process simulation and visualization tools.
