IntelliEtch is a brand-new atomistic etch simulator with several powerful capabilities. Users can take into account ab initio effects and predict evolving surface morphologies. Wet and dry etching can be performed on high order planes or non-flat substrates. An etched structure can also be exported as an FEA model for further analysis. The figure below shows the development of silicon microneedles in IntelliEtch compared with experimental SEMs. This model demonstrates several of IntelliEtch’s advanced capabilities, including multi-step mask transfers and wet/dry combination etching.

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