RECIPE, IntelliSense’s RIE/ICP etch simulator, now has the capability to simulate wet and dry etching in 3D in IntelliSuite v8.5. This tool can simulate RIE, DRIE, ICP (Inductively Coupled Plasma), and Bosch etching, as well as combinations of these processes. Combinations of anisotropic, isotropic, and directional processes can also be etched. RECIPE can help to predict etch lead and lag as shown in the picture below.

RECIPE can also be used to predict sidewall scalloping, footing, etch profiles, and sidewall angles. The Response Surface Methodology-based etch database and ability to account for machine and chamber variations ensure accurate results for any simulation.